Electronic device

ABSTRACT

An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S.application Ser. No. 16/899,784, filed Jun. 12, 2020, which claims thebenefit of priority from the prior Japanese Patent Application No.2019-116509, filed on Jun. 24, 2019, the entire contents of each ofwhich are incorporated herein by reference.

FIELD

One embodiment of the present invention relates to a display device inwhich a wiring substrate having flexibility and a display panel areconnected, an electric device in which the wiring substrate havingflexibility is connected to various substrates such as a sensorsubstrate and the manufacturing method thereof.

BACKGROUND

A flexible printed wiring substrate is used to connect the display panelto a printed circuit board (PCB). The flexible printed wiring substrateis a substrate in which the electric circuitry is formed by a metallicfoil bonded to a base film. The flexible printed wiring substrate has aflexibility and can be bent freely, making it an indispensable componentfor miniaturization, weight reduction, and thinning of variouselectronic devices such as a smart phone, a tablet device, a personalcomputer, and a liquid crystal TV. Similarly, the flexible printedwiring substrate is also used for the main substrate of an electricdevice that constitutes the sensor substrate, etc.

The flexible printed wiring substrate, since the base film is formed ofa heat-resistant and mechanical strength strong resinous material suchas polyimide, is molded into various shapes in accordance with thearrangement of a terminal of the electronic device. For example, inaddition to a rectangular connection part with the electronic device, aconnection part having a bifurcated configuration is known.

SUMMARY

An electronic device in an embodiment according to the present inventionincludes a substrate including an input terminal arranged a plurality ofterminals, a wiring substrate having a flexibility connected to theinput terminal part. The wiring substrate includes a base film having afirst surface and a second surface opposite to the first surface, acover film covering the first surface of the base film, a plurality ofwirings between the base film and the cover film, a connection part inwhich the plurality of wirings is exposed from the cover film andarranged along one side of the base film. The wiring substrate includesa first region bent in a direction crossing the one side and a secondregion adjacent to the first region. The second region of the connectionpart includes a first connection terminal group connected to theplurality of wirings, a second connection terminal group, and a dummyterminal group arranged between the first connection terminal group andthe second connection terminal group and not connected to the pluralityof wirings. The first region is provided with an opening through thebase film and the cover film, the second region overlaps the inputterminal part, and the dummy terminal group and the opening of the firstregion are adjacent to each other.

A method for manufacturing an electronic device in an embodimentaccording to the present invention, the method including bonding adisplay panel and a wiring substrate, the display panel includingdisplay part arranged a plurality of pixels and a input terminal partarranged a plurality of terminals and the wiring substrate having aflexibility that a plurality of wirings arranged between a base film anda cover film, and a connection part exposed the plurality of wiringsfrom the cover film, the bonding electrically connects the inputterminal part and the connection part, and after the adhesion, removingtogether with the base film and the cover film that a part of the areaof the wiring substrate other than the area where the plurality ofwirings is provided.

A display device in an embodiment according to the present inventionincludes a display panel including a display part arranged a pluralityof pixels and a terminal part arranged a plurality of terminals, awiring substrate having flexibility that connected to the input terminalpart. The wiring substrate includes a base film having a first surfaceand a second surface opposite to the first surface, a cover filmcovering the first surface of the base film, a plurality of wiringsbetween the base film and the cover film, and a connection part in whichthe plurality of wirings is exposed from the cover film and arrangedalong one side of the base film. The display panel includes a curvedsurface along the one side, the wiring substrate is curved in accordancewith the curvature of the display panel, and the wiring substrateincludes a first region and a second region, and the cross-sectionalarea of the first region in the direction parallel to the one side issmaller than the cross-sectional area of the second region.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a perspective view of a display device according to anembodiment of the present invention;

FIG. 2 shows a state in which a display panel and a wiring substrate areconnected that constitute a display device according to an embodiment ofthe present invention;

FIG. 3 shows a plane view of a wiring substrate to be used in a displaydevice according to an embodiment of the present invention;

FIG. 4A shows a cross-sectional view corresponding to A1-A2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 4B shows a cross-sectional view corresponding to B1-B2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 4C shows a cross-sectional view corresponding to C1-C2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 5A shows a cross-sectional view corresponding to A1-A2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 5B shows a cross-sectional view corresponding to B1-B2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 5C shows a cross-sectional view corresponding to C1-C2 line shownin FIG. 3 of a wiring substrate to be used in a display device accordingto an embodiment of the present invention;

FIG. 6 shows a plane view of a wiring substrate to be used in a displaydevice according to an embodiment of the present invention;

FIG. 7 shows a plane view of a wiring substrate to be used in a displaydevice according to an embodiment of the present invention;

FIG. 8 is a diagram illustrating a manufacturing process of a displaydevice according to an embodiment of the present invention, showing astate in which a wiring substrate before an opening is formed on adisplay panel is attached;

FIG. 9 shows a perspective view of a display device according to anembodiment of the present invention;

FIG. 10A shows a front view of an electric device having a camera moduleaccording to an embodiment of the present invention with a wiringsubstrate attached to a display panel;

FIG. 10B shows a side view of an electric device having a camera moduleaccording to an embodiment of the present invention with a wiringsubstrate attached to a display panel;

FIG. 10C shows a front view of an electric device having a camera moduleaccording to an embodiment of the present invention in which a displaypanel and a circuit board are connected by a wiring substrate; and

FIG. 10D shows a side view of an electric device having a camera moduleaccording to an embodiment of the present invention in which a displaypanel and a circuit board are connected by a wiring substrate.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the drawings and the like. The present invention may becarried out in various forms without departing from the gist thereof andis not to be construed as being limited to any of the followingembodiments. For example, although the embodiment of the presentinvention will be described with reference to a display panel, thepresent invention is not limited to this, and the display panel may bereplaced with a main substrate of a sensor substrate or other electricdevices as long as the substrate has a plurality of terminals to which aflexible printed circuit board is connected. In the drawings, componentsmay be shown schematically regarding the width, thickness, shape, andthe like, instead of being shown in accordance with the actual form, forthe sake of clear illustration. In the present specification and eachfigure, elements similar to those described above with respect to thepreviously described figures are denoted by the same reference numerals(or a number followed by a, b, etc.), and detailed description thereofmay be omitted. In addition, the letters appended “first” and “second”for each element are expedient signs used to distinguish between theelements and have no further meaning unless otherwise stated.

In this specification, when a member or region is “up (or below)” ofanother member or region, unless otherwise specified, this includes notonly a case where it is directly above (or directly below) anothermember or region but also a case where it is above (or lower) anothermember or region. That is, it includes the case where another componentis included in between above (or lower) another member or region.

First Embodiment

A configuration of a display device 100 a according to an embodiment ofthe present invention will be described in this embodiment. As shown inFIG. 1, the display device 100 a includes a display panel 102 a and awiring substrate 104. The display panel 102 a is connected to anoptional circuit board 106 by the wiring substrate 104. The circuitboard 106 is located at any location.

For example, from the viewpoint of design, the display panel is requiredto narrow a region (also referred to as a frame region) surrounding adisplay area, i.e., a so-called frame narrowing. A module with theflexible printed wiring substrate or the like mounted on the displaypanel must be sharply bent on the flexible printed wiring substrate toaccommodate them in a housing with the narrow frame region.

The flexible printed wiring substrate must be thickened in order tonarrow the pitch of a terminal. On the other hand, when the thickness ofthe flexible printed wiring substrate is increased, the elastic force isincreased and the repulsive force against bending is increased.

In this embodiment, the circuit board 106 is located on the back side ofthe display panel 102 a for compact stored in the housing of the displaydevice. The wiring substrate 104 has a flexibility and is folded toconnect the display panel 102 a and the circuit board 106. The wiringsubstrate 104 is formed with an opening 108 at a position overlapping aregion to be folded.

The display panel 102 a includes a display part 112 formed on asubstrate 110 and an input terminal 114 provided at one end of thesubstrate 110. The display panel 102 a may be provided with a verticaldriving circuit 115 and a horizontal driving circuit 116 on the outerside of the display part 112. The display panel 102 a may be providedwith a counter substrate 118 to cover at least the display part 112.Other components (e.g., backlights) may be provided between the displaypanel 102 a and the circuit board 106. The display device 100 a displaysan image by inputting a signal representing an image from the circuitboard 106 to the display panel 102 a via the wiring substrate 104, andinputting the signal to the display part 112 by the vertical drivingcircuit 115 and the horizontal driving circuit 116. In the case wherethe display device 100 a is replaced with an electric device, inparticular, the substrate 110 of the display panel 102 a is a mainsubstrate in which various members for configuring the functions of theelectric device are arranged, and for example, in the case of afingerprint sensor or a touch panel, the display part 112 may bereplaced with a fingerprint detection region or a touch detectionregion, and the substrate 102 a may be replaced with a main substrate inwhich electrodes or sensors for realizing the functions of fingerprintdetection and touch detection are arranged. Even in this case, the mainsubstrate has the input terminal 114, the wiring substrate 104 connectedto the input terminal 114 is formed with the opening 108.

FIG. 2 shows a configuration in which the display panel 102 a and thewiring substrate 104 are connected. The display panel 102 a includes thedisplay part 112 on the substrate 110 and the input terminal 114 locatedon the exterior of the display part 112. The display part 112 isarranged with a plurality of pixels 120, and a plurality of scanningsignal lines 121 and a data signal line 122 are arranged to input thesignals to each of the plurality of pixels 120. The plurality ofscanning signal lines 121 is electrically connected to the verticaldriving circuit 115 and a plurality of data signal lines 122 iselectrically connected to the horizontal driving circuit 116. Thevertical driving circuit 115 includes a circuit for outputting thescanning signal to the scanning signal line 121, and the horizontaldriving circuit 116 includes a selector circuit for selecting the datasignal line 122 for outputting a video signal.

The pixel 120 includes a display element. As the display element, aliquid crystal element in which a liquid crystal layer is providedbetween a pair of electrodes, an organic electroluminescent element inwhich an organic layer containing an organic electroluminescent materialis provided between a pair of electrodes, or a micro LED, or the likeare used. The display part 112 is provided with circuits for driving thedisplay element for each pixel 120.

The input terminal 114 is arranged at one end of the substrate 110. Theinput terminal 114 includes a plurality of terminals 124. The pluralityof terminals 124 is arranged along one side of the substrate 110 at apredetermined pitch. The input terminal 114 is a portion where a signalfor displaying an image on the display part 112 is input, a region whichis connected with a conductive adhesive so as to form an electricalconnection with the wiring substrate 104.

The wiring substrate 104 includes a wiring 128 and a connection part 126that forms a connection with the input terminal 114. The connection part126 includes a first connection part 126 a for connection with thedisplay panel 102 a and a second connection part 126 b for connectionwith the circuit board (not shown in FIG. 2). The wiring 128 is providedto electrically connect between the first connection part 126 a and thesecond connection part 126 b. A driver IC 134 may be implemented in thewiring substrate 104. The wiring 128 is arranged to electrically connectbetween the first connection part 126 a and the driver IC 134 andbetween the driver IC 134 and the second connection part 126 b.

The wiring substrate 104 has flexibility and includes a first region 130and a second region 132 adjoining the first region 130. The first region130 is defined as a region that includes a portion where the wiringsubstrate 104 is folded and may also be referred to as a folded region.The second region 132 is defined as a region other than the foldedregion. The first connection part 126 a and the second connection part126 b are included in the second region 132. For example, the wiringsubstrate 104 is bent to the back of the display panel 102 a along oneside of the substrate 110, as shown in FIG. 1. The first region 130 is aregion including a region in which the wiring substrate 104 is bent, andthe first region 130 is provided at a position adjacent to the firstconnection part 126 a and away from the second connection part 126 b.Since the first connection part 126 a and the second connection part 126b are arranged outside the bending region of the wiring substrate 104,the first region 130 is arranged to be sandwiched between the two secondregion 132. As shown in FIG. 2, assuming that the length of the wiringsubstrate 104 is L and the width is W, the first region 130 occupies apart of regions of the length L (length L1) and is defined as a regionhaving a width W.

The first region 130 includes the opening 108. The opening 108 is formedby removing a member forming the wiring substrate 104. The opening 108is formed, for example, as a through hole penetrating the wiringsubstrate 104. The opening 108 is arranged to be surrounded by thewiring 128 and the connection part 126 (the first connection part 126a). As shown in FIG. 2, the first region 130 and the second region 132occupying a constant region of each of the wiring substrate 104. Sincethe first region 130 includes the opening 108, a cross-sectional area ofthe cross section in the width direction (or a direction parallel to oneside where the terminals 124 of the substrate 110 are arranged) issubstantially smaller than that of the second region 132.

The display panel 102 is connected to the connection part 126 (the firstconnection part 126 a) of the wiring substrate 104 at the input terminal114. The input terminal 114 and the first connection part 126 a areelectrically connected to each other by an anisotropic conductive film(ACF) which is not shown. The wiring substrate 104 is thermocompressionbonded to the input terminal 114 of the display panel 102 a via theanisotropic conductive film. Thermocompression bonding is performed byapplying pressure by a pressure welding tool heated by a heater or thelike.

As shown in FIG. 2, the input terminal 114 is provided with theplurality of terminals 124. In addition to a first terminal 124 aelectrically connected to the vertical driving circuit 115 or thehorizontal driving circuit 116, the plurality of terminals 124 mayinclude a second terminal 124 b (also referred to as a dummyelectrode(s) or a dummy terminal(s)) not electrically connected to thesedriving circuits. Including the second terminal 124 b in addition to thefirst terminal 124 a, the input terminal 114 has the plurality ofterminals 124 arranged at regular pitches. With this configuration ofthe input terminal 114, when the wiring substrate 104 isthermocompression bonded to the display panel 102 a, pressure can beuniformly applied, and the effect of the thermal expansion of the wiringsubstrate 104 can be made uniform. As a result, it is possible toimprove the bonding accuracy of the display panel 102 a and the wiringsubstrate 104 by thermocompression bonding. As shown in FIG. 2, thefirst terminal 124 a consists of a plurality of terminals, separatedfrom left and right by a first terminal group (124 aL) and a secondterminal group (124 aR). The second terminal 124 b can also be referredto as a dummy terminal group 124 b consisting of a plurality ofterminals. The dummy terminal group 124 b is located between the firstterminal group 124 aL and the second terminal group 124 aR. The dummyterminal group 124 may be secured the shape stability of the wiringsubstrate 104 during thermocompression bonding, in the presentembodiment, it may be in a floating state or a grounded state.

The wiring substrate 104 is formed using a resin-made film basematerial. The film base material can be elastically deformed from a flatstate to a bent state by applying an external force. The wiringsubstrate 104 needs to have a high dimensional accuracy when it mountedon the input terminal 114 of the substrate 110 to cope with the highdefinition (narrow pitch) of the terminal. Further, there is a growingdemand for narrowing the frame when the wiring substrate 104 is bent bynarrowing the distance from the input terminal 114 to the first region130 for bending the wiring substrate 104. That is, it is required tobend a small radius of curvature of the first region 130 of the wiringsubstrate 104 at the time of bending. In order to increase thedimensional accuracy with respect to these requests, it is conceivableto form a first terminal region 114 larger, but not only retrograde tonarrowing the pitch of the terminal, but also increasing the size of thefirst terminal region, it is necessary to increase the size of thewiring substrate 104 accordingly, the repulsive force against bendingincreases when the area of the film base material of the wiringsubstrate 104 increases. When the repulsive force against the bendingincreases, it becomes an obstacle for narrowing the frame when thewiring board 104 is bent. That is, it becomes difficult to bend theradius of curvature small. On the other hand, in order to cope with thenarrowing of the frame of the wiring substrate 104, it is necessary toreduce the repulsive force of the film base material, for example, usinga bifurcated wiring substrate as described in the prior art document isalso an effective means for reducing the repulsive force, but oneterminal group and the other terminal group which are the terminalgroups branched into two, are mounted on the terminals with a narrowpitch, there is a concern that the yield at the time of dimensionalaccuracy adjustment at the time of mounting may deteriorate. It isconceivable to mount one and the other of the branched terminals at thesame time at the same time, but in this case, the difficulty of matchingthe respective dimensions becomes extremely high. In contrast, thewiring substrate 104 according to the present embodiment, by includingthe opening 108 to the first region 130 serving as a bent portion, iseasily bent repulsive force is suppressed. The wiring substrate 104further includes the second terminal 124 b, so that the first terminalgroup 124 aL and the second terminal group 124 aR, which are the firstterminal 124 a, can be uniformly mounted simultaneously in one process.

FIG. 3 shows a plane view of the wiring substrate 104. Thecross-sectional constructions of A1-A2 line, B1-B2 line, and the wiringsubstrate 104 along C1-C2 line shown in FIG. 3 are shown in FIG. 4A,FIG. 4B, and FIG. 4C, respectively. FIG. 4A shows a cross-sectionalstructure of the longitudinal direction of the wiring substrate 104,FIG. 4B shows a cross-sectional structure of the first region 130, andFIG. 4C shows a cross-sectional structure of the second region 132. Thefollowing description will be given with reference to these drawings asappropriate.

The wiring substrate 104 includes a first surface and a base film 136having a second surface opposite to the first surface, a cover film 138covering the first surface side of the base film 136, and the wiring128. The wiring 128 is formed of a conductor such as a metal foil isprovided between the base film 136 and the cover film 138. A pluralityof wirings 128 is provided on the base film 136 in an electricallyisolated manner. The first connection part 126 a and the secondconnection part 126 b are formed in a region in which the wiring 128 isexposed from the cover film 138 at one end of the base film 136. Asshown in the FIG. 4A, the connection part 126 may have a plated film 129formed on the surface of the wiring 128 exposed from the cover film 138.

As previously mentioned, the wiring substrate 104 may have a region onwhich the driver IC 134 is implemented. The plurality of wirings 128 isprovided to electrically connect between the first connection part 126 aand the driver IC 134 and between the driver IC 134 and the secondconnection part 126 b as appropriate. An adhesive (not shown) may beinterposed between the cover film 138 and the base film 136.

The wiring substrate 104 is provided with the opening 108 in the firstregion 130. As shown in FIG. 3, the opening 108 is provided so as to besurrounded by the plurality of wirings 128 and the connection part 126.As shown in FIG. 4B, the opening 108 is a region in which the base film136 and the cover film 138 are removed. The opening 108 may also beconsidered a through hole penetrating the base film 136 and the coverfilm 138. As is apparent from the comparison between FIG. 4B and FIG.4C, the first region 130 includes the opening 108, thereby reducing thecross-sectional area of the cross section as compared with the secondregion 132.

The first region 130 includes the opening 108, the repulsive forceagainst bending of the wiring substrate 104 is a small region comparedto the second region 132. That is, the first region 130, since thesubstantial area is smaller than the second region 132, the rigidity isreduced and is an easily bent region. On the other hand, the firstconnection part 126 a and the second connection part 126 b are providedin the second region 132, thereby maintaining the rigidity. Theconnection part 126 includes a first terminal 127 a connected to thewiring 128 and a second terminal 127 b used as a dummy terminal, therebyensuring shape-stability at the time of thermocompression bonding. Alsofor the first terminal 127 a and the second terminal 127 b of the wiringsubstrate 104, the first terminal 127 a includes a first connectionterminal group 127 aL and a second connection terminal group 127 aR, thesecond terminal 127 b may be referred to as a dummy terminal group 127b, and the dummy terminal group 127 b is located between a firstconnection terminal group 127L and the second connection terminal group127 aR. In this embodiment, although the dummy terminal group 127 b ofthe wiring substrate 104 is connected to the dummy terminal group 124 bof the input terminal 114, it is not connected to the wiring 128 of thewiring substrate 104.

In order to achieve with the high definition (high density of pixel) ofthe display part 112 in the display panel 102 a, the wiring 128 of thewiring substrate 104 also needs to be high densified. To increase thedensity of the wiring 128, it is required to increase the rigidity ofthe base film 136 and to ensure the dimension is stable. When thethickness of the base film 136 is increased, the rigidity becomes highand difficult to bend the base film 136. On the other hand, in thedisplay device 100 a, there is a demand for so-called the framenarrowing, in which the frame region (peripheral region surrounding thedisplay part 112) is narrowed at the same time as high definition isachieved. If you try to bend the wiring substrate 104 at an acute angleto meet this requirement, the repulsive force against the bending of thebase film 136, a large force is applied to the input terminal 114,peeling of the terminal 124, and even if it does not lead to peeling, itis feared that the electrical connection becomes poor. However, thewiring substrate 104 according to the present embodiment can reduce therepulsive force against bending of the base film 136 by providing theopening 108 in the first region 130 serving as a bending part. In otherwords, even if the thickness of the base film 136 is increased, it ispossible to bend the radius of curvature smaller than the conventional,it is possible to increase the reliability of the connection part.

The shape in the planar view of the opening 108 is not limited to arectangular shape as shown in FIG. 3, and may be any shape such as acircular shape, an elliptical shape, a triangle, a polygon having alarger number of squares than a square (e.g., hexagonal), a shape inwhich the corners of the aforementioned square shape are rounded, andthe like.

The wiring substrate 104 may be provided with a shield electrode. FIG.5A, FIG. 5B, and FIG. 5C shows a cross-sectional structure correspondingto A1-A2 line, B1-B2 line, and C1-C2 line shown in FIG. 3, respectively,and shows a cross-sectional structure of the wiring substrate 104 inwhich a shield electrode 140 is provided. The shield electrode 140 isprovided on substantially the entire surface of the second surface sideof the base film 136 (the side opposite to the first surface where thewiring 128 is provided). The wiring substrate 104 has a configuration inwhich the wiring 128 is covered with a cover film 138 a and the shieldelectrode 140 is covered with a cover film 138 b. The opening 108 isprovided to penetrate the cover film 138 a, the base film 136, theshield electrode 140, and the cover film 138 b. Thus, even when theshield electrode 140 is provided on the wiring substrate 104, it ispossible to reduce the repulsive force against bending of the wiringsubstrate 104 by similarly providing the opening 108.

As shown in FIG. 6, the wiring substrate 104 may be provided with aplurality of openings 108 a and 108 b in the first region 130. Theplurality of wirings 128 on the base film 136 is provided to surroundthe openings 108 a, 108 b. By providing the plurality of openings 108 a,108 b, the opening region can be dispersed in the first region 130 andthe cross-sectional area can be reduced. A configuration in which aplurality of openings is provided in the first region 130 is effectivein reducing the routing length of the wiring 128 when the width of thewiring substrate 104 is widened to keep the bent state uniform.

As shown in FIG. 7, the wiring substrate 104 may be provided with anotch portion 109 in place of the opening in the first region 130. Thenotch portion 109 may be provided on both sides ends of the wiringsubstrate 104 or may be provided on one side. In both cases, the notchportion 109 is formed as a region with the base film 136 and the coverfilm 138 removed. Thus, it is possible to reduce the cross-sectionalarea of the cross section of the first region 130 also by providing thenotch portion 109, it is possible to reduce the repulsive force againstbending of the wiring substrate 104.

According to this embodiment, by having the opening 108 or the notchportion 109 to the wiring substrate 104, it is possible to easily bendthe wiring substrate 104. The wiring substrate 104 can be bent closer tothe display panel 102 a by providing one or both of the opening 108 andthe notch portion 109 to the region (the first region 130) to be bent.As a result, the display device 100 a can reduce the area occupied bythe region (the region surrounding the display part 112) other than thedisplay part 112, thereby narrowing the frame.

Second Embodiment

In the present embodiment, a manufacturing process of the display device100 a shown in the first embodiment will be described. In the displaydevice 100 a, the display panel 102 a is manufactured, and thereafter,the wiring substrate 104 is attached to the display panel 102 a.

FIG. 8 shows the display panel 102 a in which the wiring substrate 104attached. The wiring substrate 104 is attached to the display panel 102a via the anisotropic conductive film (not shown). For example, thewiring substrate 104 is attached to the input terminal 114 bythermocompression bonding. The wiring substrate 104 includes the regionwhich becomes the first region 130 and the region which becomes thesecond region 132, but the opening is not formed in the first region 130at this stage. By attaching the wiring substrate 104 to the displaypanel 102 a without the opening, the deflection and deformation of theconnection part 126 can be suppressed, and the dimensional accuracy atthe time of bonding can be kept high.

The wiring board 104 is performed a deformed processing after beingattached to the display panel 102 a. For example, after the wiringsubstrate 104 is attached to the display panel 102 a, the opening 108 orthe notch portion 109 is formed by laser beam processing. The wiringsubstrate 104 is attached to the display panel 102 a so that the opening108 can be formed proximate to the connection part 126 (the firstconnection part 126 a). This allows the wiring substrate 104 to befolded proximate to the display panel 102 a. The opening 108 or thenotch portion 109 of the wiring board 104 may be formed by a dieprocessing or a cutting processing. The opening 108 or the notch portion109 formed in the wiring substrate 104 may be formed in the formdescribed referring to FIGS. 3, 6, and 7, as appropriate.

According to the present embodiment, by attaching to the display panel102 a without forming the opening 108 on the wiring substrate 104, thedimensional accuracy can be improved, and it is possible to cope withthe narrowing of the pitches of the terminal 124 (the first terminalgroup 124 aL, the second terminal group 124 aR, the dummy terminal group124 b). The opening 108 or the notch portion 109 may be providedproximate to the display panel 102 a by forming the opening 108 or thenotch portion 109 after the wiring substrate 104 is attached to thedisplay panel 102 a. Such a manufacturing process makes it possible toreduce the radius of curvature at the time of folding the wiringsubstrate 104 and to bend it proximate to the display panel 102 a.

In the case of laser beam processing, the base film 136, the cover film138, the shield electrode 140, or the like may have minute burnt marksor soot due to heat, but in the case of the wiring 128, the wiring 128at a position close to the opening 108 is covered with the base film 136or the cover film 138 so as not to affect the laser beam processing orthe like, so that the soot attached to the opening 108 does not contactthe wiring 128. Similarly, if the notch 109 formed by the die processingor the cutting processing, a minute beard-like burr or the like may beformed on the base film 136 or the cover film 138, or the shieldelectrode 140 during the processing, but the wiring 128 itself isprotected by the base film 136 and the cover film 138 around it, inparticular, the beard-like burr of the shield electrode 140 does notcontact the wiring 128.

Third Embodiment

This embodiment shows a display device 100 b in which the wiringsubstrate 104 is mounted on the display panel 102 having flexibility.FIG. 9 shows a perspective view of the display device 100 b according tothe present embodiment. The display device 100 b includes a displaypanel 102 b with flexibility and the wiring substrate 104 withflexibility. The display panel 102 b has flexibility and a curved shapealong the direction in which the terminal 124 (the first terminal group124 aL, the second terminal group 124 aR, the dummy terminal group 124b) of the input terminal 114 is arranged.

The wiring substrate 104 is provided along the curved surface of thedisplay panel 102 b. That is, the wiring substrate 104 also has a curvedshape. The wiring substrate 104 includes the first region 130 and thesecond region 132. The cross-sectional area of the cross section alongthe curved surface of the first region 130 is smaller than thecross-sectional area of the cross section of the second region. Sincethe wiring substrate 104 includes the first region 130, it can be freelycurved with the display panel 102 b. The first region 130 is realized byincluding the opening 108 or the notch portion (not shown) in the samemanner as the first embodiment. In this embodiment, the opening 108 ofthe wiring substrate 104 is formed after being attached to the displaypanel 102 b in the same manner as the second embodiment.

If an opening such as a slit is formed in advance in the wiringsubstrate, distortion occurs in the mounting process, it is conceivablethat adversely affect the accuracy of the bonding. However, as in thepresent embodiment, after attaching the wiring substrate 104 to thedisplay panel 102, by forming the opening 108, it is possible to ensurethe accuracy of the bonding. Depending on how the display panel 102 b iscurved, the plurality of openings 108 may be formed in the wiringsubstrate 104. The wiring substrate 104, instead of the opening 108, maybe provided with the notch portion 109 as shown in FIG. 7. In eithercase, by performing processing to reduce the cross-sectional area of thecross section of the part of region of the wiring substrate 104, it ispossible to provide the wiring substrate 104 in a stable state to thedisplay panel 102 having a curved surface. The display device 100 baccording to the present embodiment can be manufactured by the samemethod as the manufacturing method shown in the second embodiment.

Fourth Embodiment

This embodiment shows an aspect of an electric device having a cameramodule. FIG. 10A shows a front view of the electric device 100 c withthe wiring substrate 104 attached to the display panel 102, and FIG. 10Bshows a side view thereof. FIG. 10C shows a front view of the electricdevice 100 c with the wiring substrate 104 bent and connected to thedisplay panel 102 and the circuit board 106, and FIG. 10D shows a sideview thereof.

As shown in FIG. 10A, the electric device 100 c is provided with acamera module 142 on a region overlapping with the display part 112. Asshown in FIG. 10B, the camera module 142 is provided on the rear side ofthe display panel 102. The camera module 142 is provided to allowimaging of the front side through the display panel 102. In the displaypanel 102, the region overlapping the camera module 142 is a non-displayregion, the light guide path is provided so that the outside light canbe incident. On the back side of the display panel 102, a circuit board106, a backlight module 107 and the like can be appropriately arranged.

FIGS. 10C and 10D show the wiring substrate 104 bent to connect thedisplay panel 102 to the circuit board 106. In the wiring substrate 104,each of the first connection terminal group 127 aL, the secondconnection terminal group 127 aR, and the dummy terminal group 127 bincluded in the first connection part 126 a is electrically connected tothe input terminal 114 of the display panel 102, and the secondconnection part 126 b is electrically connected to the circuit board106. In the wiring substrate 104, the opening 108 is provided in theregion overlapping the camera module 142 when the wiring substrate 104bent. With such the opening 108 provided, in addition to being able toeasily bend the wiring substrate 104, even if the camera module 142protrudes at the back of the display panel 102, the wiring substrate 104can be bent so as not to interfere with the camera module 142. That is,it is possible to bend the wiring substrate 104 so that the cameramodule 142 protrudes from the opening 108. In other words, the wiringsubstrate 104 has the opening 108 so that it can be bent to reduce theradius of curvature without being affected by the camera module 142provided on the back of the display panel 102.

The position of the camera module 142 provided on the back of thedisplay part 112 is optional and for example, it may be provided towardthe center of the upper end of the display part 112. The position andthe size of the opening 108 in the wiring substrate 104 can beappropriately set in accordance with the arrangement of the cameramodule 142. In place of the camera module or in addition to the cameramodule, the wiring substrate 104 can be compactly folded by similarlyproviding the opening 108 when a module such as a sensor is placed onthe back side of the display panel 102. The wiring substrate 104 canobtain the same effects even if the notch portion 109 as shown in FIG. 7is provided instead of the opening 108.

According to the present embodiment, by providing the opening 108 to thewiring substrate 104 in accordance with the arrangement of thecomponents such as the camera module to be installed on the back of thedisplay panel 102, it is possible to reduce the repulsive force againstthe bending of the wiring substrate 104, and to bend the wiringsubstrate 104 so as not to interfere with the installed components.

What is claimed is:
 1. An electronic device, comprising: a substratehaving a first surface and a second surface opposite the first surfaceand including an input terminal part on the first surface; a wiringsubstrate having a flexibility connected to the input terminal part; andan electronic component on the second surface of the substrate, whereinthe wiring substrate has an opening through the wiring substrate, andthe opening overlaps with the electronic component when the wiringsubstrate is bent to a side of the second surface of the substrate. 2.The electronic device according to claim 1, wherein the electroniccomponent is a camera module or sensor module.
 3. The electronic deviceaccording to claim 2, wherein the opening is inside a peripheral portionof the wiring substrate.
 4. The electronic device according to claim 3,wherein the wiring substrate includes a plurality of wiring and aconnection terminal group arranged with a plurality of connectionterminals in a first direction, the connection terminal group includes afirst connection terminal group, a second connection terminal group, anda dummy connection terminal group between the first connection terminalgroup and the second connection terminal group, the plurality of wiringconnects to the first connection terminal group and the secondconnection terminal group, the dummy connection terminal group is notconnected to the plurality of wiring, and the opening is adjacent to thedummy connection terminal group in a second direction intersecting withthe first direction.
 5. The electronic device according to claim 4,wherein the input terminal part includes a first input terminal group, asecond input terminal group, and a dummy input terminal group betweenthe first input terminal group and the second input terminal group, andeach input terminal group includes a plurality of terminals arranged inthe first direction, and the first input terminal group and the firstconnection terminal group, the second input terminal group and thesecond connection terminal group, and the dummy input terminal group andthe dummy connection terminal group are connected by an anisotropicconductive film.
 6. The electronic device according to claim 5, whereina portion of the opening is in a folded region of the wiring substratewhen the wiring substrate is bent to the side of the second surface. 7.The electronic device according to claim 3, wherein a portion of theopening is in a folded region of the wiring substrate when the wiringsubstrate is bent to the side of the second surface.
 8. The electronicdevice according to claim 5, wherein the substrate includes a displaypart and a driving circuit outside of the display part, the first inputterminal group and the second input terminal group are connected to thedriving circuit, and the dummy input terminal group is in a floatingstate or grounded state.
 9. The electronic device according to claim 1,wherein the electronic component protrudes through the opening of thewiring substrate.
 10. The electronic device according to claim 5,wherein the substrate is curved along the first direction and the firstsurface is convex, and the wiring substrate is bent to a curved regionon the side of the substrate.